BVS, EDX, DoceoTech, And EGS Technologies Announce Their American Made Rural Broadband Wireless Network Design Package

Berkeley Varitronics Systems, Inc., EDX Wireless, DoceoTech, and EGS Technologies have collaborated to develop a comprehensive, integrated package to help the rural broadband build-out that is part of the American Recovery and Reinvestment Act of 2009 (ARRA) economic stimulus package providing broadband access to the rural and underserved areas throughout the United States. The National Telecommunications & Information Administration (NTIA) is issuing grants through the Broadband Technology and Opportunities Program (BTOP) and the Department of Agriculture's Rural Utilities Service (RUS) program is offering grants, loans and loan guarantees that will fund the build out of rural broadband for municipalities and state governments, utility companies, and the rural telecom providers.

The collective, integrated package allows for a streamlined procurement of wireless propagation test equipment, RF planning tools, geodata tools, and tailored technical training for several broadband technologies. These include WiFi, WiMAX and LTE.

"By having this basic integrated wireless engineering tool set, grant applicants can provide more definitive data on the underserved areas they are proposing to cover as well as the coverage available after deployment," says Jennifer Duncan, executive director of business development for EDX. "Further, this package provides applicants with a valuable return on investment because it will provide a way to consistently plan for both the initial deployments as well as the next phase of network build outs, and it provides industry standard tools to effectively communicate with federal and state agencies as well as other ARRA initiatives."

"Our 'American Made' Wireless Network Design Package will offer companies a turnkey solution for their wireless needs." states Scott Schober, President and CEO of Berkeley Varitronics Systems.

This integrated package is scheduled for release in early April, 2009. It has been competitively priced to meet the needs of the expected applicants and is available as a package from any of the collaborating companies.

SOURCE: Berkeley Varitronics Systems